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1、Glass thickness: 0.1-1.2mm 2、Edge breakage size: ＜0.005mm 3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL<50µm, T=0.7mm Corning 4、Non-contact processing, little damage to the material, high cutting precision.
● Glass thickness: 0.1-1.2mm
● Edge breakage size: ＜0.005mm
● Processing speed: 4s/pcs, 115*60mm, R5mm,DOL<50µm, T=0.7mm Corning
● Non-contact processing, little damage to the material, high cutting precision
● Layering 3d cutting, used for cutting non-tempered glass and tempered glass
● The action time of single laser spot is short, the heat-affect- ed zone is small, and no broken glasses are produced.
● It can be used with linear motor together to cut in a high speed and high efficiency
Applicable for the high-speed specially-shaped cutting of glass and sapphire with DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover plate of Home key, and optical lens.
| Overall technical parameter | |
|---|---|
| Processing scope | 150X150mm（Automatic）； 300X250mm（Manual） |
| Platform repeated positioning precision | ±1μm |
| Platform dynamic positioning precision | ±3μm |
| Max. moving speed of platform | 1000mm/s |
| CCD positioning precision | ±0.01mm |
| Machine weight | ≤3.5T |
| Cutting thickness | 0.7mm（once） |
| Edge breakage value | ≤10μm |
| Laser technical parameter | |
|
Laser type |
Infrared picosecond |
|
Wavelength |
1064nm |
| Power | 20W |
| Pulse width | <10ps |
| Cooling mode | Water cooling |
| Laser power supply | 380V, 3PH, 8kW |
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